Author:
Turk M.C.,Walters M.J.,Roy D.
Subject
Condensed Matter Physics,General Materials Science
Reference89 articles.
1. Chemical mechanical planarization: slurry chemistry, materials, and mechanisms;Krishnan;Chem. Rev.,2009
2. Deposition of copper on ruthenium for Cu metallization;Kelly;ECS Trans.,2010
3. Electrodeposition of copper on oxidized ruthenium;Guo;J. Electrochem. Soc.,2006
4. Seedless superfill: copper electrodeposition in trenches with ruthenium barriers;Josell;Electrochem. Solid-State Lett.,2003
5. International Technology Roadmap for Semiconductors, Interconnect Summary, International Technology Roadmap for Semiconductors;ITRS,2013
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