Deposition of Copper on Ruthenium for Cu Metallization
Author:
Publisher
The Electrochemical Society
Link
https://iopscience.iop.org/article/10.1149/1.3485251/pdf
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects;International Journal of Molecular Sciences;2022-02-08
2. Tribo-electrochemical investigation of a slurry composition to reduce dissolution and galvanic corrosion during chemical mechanical planarization of Cu-Ru interconnects;Materials Chemistry and Physics;2017-11
3. Effect of ionic strength on ruthenium CMP in H2O2-based slurries;Applied Surface Science;2014-10
4. Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias;Electrochimica Acta;2013-06
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