Author:
Inoue Fumihiro,Philipsen Harold,Radisic Aleksandar,Armini Silvia,Civale Yann,Leunissen Peter,Kondo Muneharu,Webb Eric,Shingubara Shoso
Subject
Electrochemistry,General Chemical Engineering
Reference39 articles.
1. Future system-on-silicon LSI chips;Koyanagi;IEEE Micro,1998
2. The rise of the 3rd dimension for system intergration;Beyne;International Interconnect Technology Conference,2006
3. Architectural implications and process development of 3-D VLSI Z-axis interconnects using through silicon vias;Schaper;IEEE Transactions on Advanced Packaging,2005
4. Technologies for very high bandwidth electrical interconnects between next generation VLSI circuits;Beyne;IEEE-IEDM 2001 Technical Digest,2001
5. Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed;Armini;Journal of the Electrochemical Society,2011
Cited by
44 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献