Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate
Author:
Funder
Ministry of Education, Culture, Sports, Science and Technology
NEDO
Publisher
Elsevier BV
Reference25 articles.
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3. Electroless Cu-plated Ni3Sn4 alloy used as anode material for lithium ion battery;Cheng;J Alloys Compd,2005
4. Challenges in introducing high-density interconnect technology in printed circuit boards for space applications;Cauwe;CEAS Space Journal,2023
5. K. Zeng, J. Williamson, Improve Interconnect Reliability of BGA Substrate with Stacked Vias by Reducing Carbon Inclusion in the Interface Between Via and Land Pad, in: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), IEEE, 2018: pp. 150–156. doi: 10.1109/ECTC.2018.00031.
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