Publisher
Springer Science and Business Media LLC
Subject
Space and Planetary Science,Aerospace Engineering
Reference22 articles.
1. Buffardo, M., Scione, E., Fabio, C.T., Daniele, C., Giovanni, R.E.: Implementation of double insulation at satellite level: an approach. 2019 European Space Power Conference (ESPC), France, 2019.
2. Birch, B., Straznicky, I., Smetana, J.: Reliability testing of multiple level microvia structures following exposure to lead-free assembly. SMTA International 2017 Proceedings, Rosemont, IL, 2017.
3. Bakhshi, R., Azarian, M.H., Pecht, M.G.: Effects of voiding on the degradation of microvias in high density interconnect printed circuit boards under thermomechanical stresses. IEEE Trans. Compon. Packag. Manuf. Technol. 4(8), 1374–1379 (2014)
4. Salahouelhadj, A., Martiny, M., Mercier, S., Bodin, L., Manteigas, D., Stephan, B.: Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications. Microelectron. Reliab. 54(1), 204–213 (2014)
5. McCurdy, M., de Sousa, I., Martel, R., Lessard, A.: CGA trends and capabilities. SMTA International 2015 Proceedings, Rosemont, IL, 2015.
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献