Synergistic Effect of Glycine and BTA on Step Height Reduction Efficiency after Copper CMP in Weakly Alkaline Slurry-Reference-Cited by-同舟云学术

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Synergistic Effect of Glycine and BTA on Step Height Reduction Efficiency after Copper CMP in Weakly Alkaline Slurry

Published:2016-12-02 Issue:1 Volume:6 Page:P1-P6
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Yan Chenqi,Liu Yuling,Zhang Jin,Wang Chenwei,Zhang Wenxia,He Ping,Pan Guofeng

Funder

Major National Science and Technology Special Projects

Natural Science Foundation for the Youth of Hebei Province

Natural Science Key Project of Hebei Province

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference36 articles.

1. Synergetic effect of benzotriazole and non-ionic surfactant on copper chemical mechanical polishing in KIO4-based slurries

2. Synergetic effect of H2O2 and glycine on cobalt CMP in weakly alkaline slurry

3. Role of Guanidine Carbonate and Crystal Orientation on Chemical Mechanical Polishing of Ruthenium Films

4. Corrosion Inhibitors in Sodium Periodate Slurry for Chemical Mechanical Planarization of Ruthenium Film

5. Cobalt Polishing with Reduced Galvanic Corrosion at Copper/Cobalt Interface Using Hydrogen Peroxide as an Oxidizer in Colloidal Silica-Based Slurries

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1. Effects of pyrazine and its derivatives as inhibitors on copper film chemical-mechanical polishing properties for ruthenium-based copper interconnect;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-05

2. 6061铝合金近原子尺度化学机械抛光工艺优化;Acta Optica Sinica;2024

3. Study on the surface interaction mechanism, corrosion inhibition effect and the synergistic action of potassium oleate and fatty alcohol polyoxy ethylene ether on copper film chemical mechanical polishing for giant large scale integrated circuit;Thin Solid Films;2023-06

4. Experimental and computational investigation of complexing agents on copper dissolution for chemical mechanical polishing process;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2023-05

5. Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process;Applied Sciences;2023-03-15

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