Effects of pyrazine and its derivatives as inhibitors on copper film chemical-mechanical polishing properties for ruthenium-based copper interconnect
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Published:2024-05
Issue:
Volume:688
Page:133609
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ISSN:0927-7757
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Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
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language:en
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Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
Author:
Zhan Ni,
He Chao,
Niu XinhuanORCID,
Zhang Nannan,
Zou Yida,
Liu Jianghao,
Dong Changxin,
Li Xinjie,
Zhou Jianwei