Author:
Ernur D.,Terzieva V.,Wu W.,Brongersma S. H.,Maex K.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. J. Edelstein, R. Heindenreich, W. Goldblatt, C. Cote, N. Uzoh, P. Lustig, T. Roper, W. McDevitt, A. Motsiff, J. Simon, R. Dukovic, H. Wachnik, R. Rathore, L. Schulz, L. Su, S. Luce, and J. Slattery,Proceedings of International Electron Devices Meeting (IEDM), IEEE, p. 773 (1997).
2. Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing
3. Control of Photocorrosion in the Copper Damascene Process
4. Narrow Trench Corrosion of Copper Damascene Interconnects
5. D. Ernur, L. Carbonell, and K. Maex,Materials Research Society Spring Meeting, Symposium Z, Online Proceedings (2003).
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献