Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing-Reference-Cited by-同舟云学术

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Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing

Published:2000-11-15 Issue:Part 1, No. 11 Volume:39 Page:6216-6222
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kondo Seiichi,Sakuma Noriyuki,Homma Yoshio,Ohashi Naofumi

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 62 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Removal of Tantalum Layer from Nb 3Sn Superconducting Wire and Corrosion Mechanism;ACTA METALL SIN;2024

2. Effects of Hydrogen Peroxide on Chemical Mechanical Polishing of Copper Surface: Exploration of Reaction Pathways with Molecular Dynamics Simulation and Activation Energies Calculation;Tribology Online;2024-05-15

3. Competitive effect between corrosion inhibitors in copper chemical mechanical polishing;Materials Science in Semiconductor Processing;2023-07

4. Characterizations of micro bump undercuts for chiplets integrated packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

5. Analyzing the effects of pad asperity on chemical mechanical polishing of copper thin film wafer;Japanese Journal of Applied Physics;2022-07-01

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