Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration-Reference-Cited by-同舟云学术

Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration

Published:2006 Issue:4 Volume:153 Page:G291
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Niklaus F.,Kumar R. J.,McMahon J. J.,Yu J.,Lu J.-Q.,Cale T. S.,Gutmann R. J.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference24 articles.

1. Low-temperature full wafer adhesive bonding

2. J.-Q. Lu, A. Jindal, Y. Kwon, J. J. McMahon, M. Rasco, R. Augur, T. S. Cale, and R. J. Gutmann ,IEEE Proc. IITC 2003, pp. 74–76, IEEE Burlingame, CA (2003).

3. R. J. Gutmann, J.-Q. Lu, S. Pozder, Y. Kwon, D. Menke, A. Jindal, M. Celik, M. Rasco, J. J. McMahon, K. Yu, and T. S. Cale ,Proc. Advanced Metallization Conference 2003, 19–26, MRS, Montreal, Canada (2004).

4. Y. Kwon , Ph.D. Thesis, Rensselaer Polytechnic Institute, Troy, NY (2003).

5. Low temperature full wafer adhesive bonding of structured wafers

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