Low temperature full wafer adhesive bonding of structured wafers-Reference-Cited by-同舟云学术

Low temperature full wafer adhesive bonding of structured wafers

Published:2001-08 Issue:1-3 Volume:92 Page:235-241
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Niklaus F.,Andersson H.,Enoksson P.,Stemme G.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference6 articles.

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2. F. Niklaus, P. Enoksson, E. Kälvesten, G. Stemme, Void-free full wafer adhesive bonding, in: Proceedings of the MEMS 2000, Miyazaci, Japan, 23–27 January 2000, pp. 247–252.

3. Datasheet processing procedures for dry-etch CYCLOTENE advanced electronics resins (Dry-Etch BCB), The Dow Chemical Company, 1997.

4. Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels;Andersson;Sens. Actuators B: Chem.,2000

5. Micromachined flow-through filter-chamber for chemical reactions on beads;Andersson;Sens. Actuators B: Chem.,2000

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