Novel wafer-scale adhesive bonding with improved alignment accuracy and bond uniformity-Reference-Cited by-同舟云学术

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Novel wafer-scale adhesive bonding with improved alignment accuracy and bond uniformity

Published:2023-02 Issue: Volume:270 Page:111936
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Abdi Salim,de Vries Tjibbe,Spiegelberg Marc,Williams Kevin,Jiao Yuqing

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS;Lapisa;IEEE J. Sel. Top. Quantum Electron.,2011

2. InP membrane integrated photonics research;Jiao;Semicond. Sci. Technol.,2020

3. Towards the Integration of InP Photonics With Silicon Electronics: Design and Technology Challenges;Yao;J. Lightwave Technol.,2021

4. “Polymer Bonding,” in 3D and Circuit Integration of MEMS;Wang,2021

5. Adhesive wafer bonding;Niklaus;J. Appl. Phys.,2006

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