Towards the Integration of InP Photonics With Silicon Electronics: Design and Technology Challenges-Reference-Cited by-同舟云学术

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Towards the Integration of InP Photonics With Silicon Electronics: Design and Technology Challenges

Published:2021-02-15 Issue:4 Volume:39 Page:999-1009
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:
Short-container-title:J. Lightwave Technol.

Author:

Yao Weiming^ORCID,Liu Xiao^ORCID,Matters-Kammerer M. K.,Meighan Arezou,Spiegelberg Marc,Trajkovic Marija^ORCID,van der Tol Jos J. G. M.^ORCID,Wale Michael J.,Zhang Xi,Williams Kevin

Funder

EU H2020 programme

EU-project GeTPIC

Dutch research agency NWO

Dutch Stimulus OPZuid programme

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/50/9348993/09290349.pdf?arnumber=9290349

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics;IEEE Transactions on Semiconductor Manufacturing;2024-08

2. Efficient heat sink by ultrathin BCB bonding for InP membrane lasers;Japanese Journal of Applied Physics;2024-04-01

3. High-Precision Mapping and Analysis of Wafer-Scale Distortions in InP Membranes to Si 3D Integration;IEEE Access;2024

4. 大规模硅基光电子集成芯片技术与挑战（特邀）;Acta Optica Sinica;2024

5. Low Loss InP U-Bend Gain Waveguides for Hybrid Integration with Silicon Photonics;2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC);2023-06-26

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