Effect of Potassium Ions on Tantalum Chemical Mechanical Polishing in H2O2-Based Alkaline Slurries
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference60 articles.
1. Copper metallization for ULSL and beyond
2. Formation of copper silicides from Cu(100)/Si(100) and Cu(111)/Si(111) structures
3. Reaction of nanometer-sized Cu particles with a SiO2 substrate
4. Comparative study of Ta, TaN and Ta/TaN bi-layer barriers for Cu-ultra low-k porous polymer integration
5. Superior thermal stability of Ta/TaN bi-layer structure for copper metallization
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