Bonding for 3-D Integration of Heterogeneous Technologies and Materials-Reference-Cited by-同舟云学术

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Bonding for 3-D Integration of Heterogeneous Technologies and Materials

Published:2019-12-18 Issue:8 Volume:16 Page:3-13
ISSN:1938-6737
Container-title:ECS Transactions
language:
Short-container-title:ECS Trans.

Author:

Temple Dorota,Malta Dean,Lannon John M.,Lueck Matthew,Huffman Alan,Gregory Christopher,Robinson J. E.,Coffman P. R.,Welch T. B.,Skokan M. R.

Publisher

The Electrochemical Society

Link

https://iopscience.iop.org/article/10.1149/1.2982849/pdf

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Technical service platform planning based on a company’s competitive advantage and future market trends: A case study of an IC foundry;Computers & Industrial Engineering;2016-09

2. Advances in three-dimensional integration technologies in support of infrared focal plane arrays;Quantum Sensing and Nanophotonic Devices XII;2015-02-08

3. Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications;Japanese Journal of Applied Physics;2015-01-19

4. Cu-SiO2Hybrid Bonding;Handbook of 3D Integration;2014-06-20

5. Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics;SPIE Proceedings;2014-05-21

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