Advances in three-dimensional integration technologies in support of infrared focal plane arrays-Reference-Cited by-同舟云学术

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Advances in three-dimensional integration technologies in support of infrared focal plane arrays

Published:2015-02-08 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Quantum Sensing and Nanophotonic Devices XII
language:
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Author:

Temple D. S.,Vick E. P.,Malta D.,Lueck M. R.,Skokan M. R.,Masterjohn C. M.,Muzilla M. S.

Publisher

SPIE

Reference12 articles.

1. Case for small pixels: system perspective and FPA challenge;Robinson,2014

2. Spatial oversampling in imaging sensors: benefits in sensitivity and detection;Caulfield,2013

3. Digital pixel CMOS focal plane array with on-chip multiply accumulate units for low-latency image processing;Kelly,2014

4. Progress in the development of vertically integrated sensor arrays;Balcerak,2005

5. Development of two-color focal-plane arrays based on HDVIP;Dreiske,2005

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Scaling infrared detectors—status and outlook;Reports on Progress in Physics;2022-11-24

2. Novel infrared focal plane array technology;AOPC 2020: Infrared Device and Infrared Technology;2020-11-05

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