Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications-Reference-Cited by-同舟云学术

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications

Published:2015-01-19 Issue:3 Volume:54 Page:030202
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Temple Dorota S.,Lueck Matthew R.,Malta Dean,Vick Erik P.

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/54/i=3/a=030202/pdf

Reference31 articles.

1. Progress in the development of vertically integrated sensor arrays (Invited Paper)

2. Case for small pixels: system perspective and FPA challenge

3. High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors

4. Bonding for 3-D Integration of Heterogeneous Technologies and Materials

5. Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics

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2. Modeling Insights Into the Assembly Challenges of Focal Plane Arrays;IEEE Access;2023

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4. Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications;Microelectronic Engineering;2019-04

5. Effects of forming gas plasma treatment on low-temperature Cu–Cu direct bonding;Japanese Journal of Applied Physics;2016-05-27