1. Progress in the development of vertically integrated sensor arrays;Balcerak,2005
2. Development of two-color focal-plane arrays based on HDVIP;Dreiske,2005
3. High density 3-D integration technology for massively parallel signal processing in advanced infrared focal plane array sensors;Temple,2006
4. Bonding for 3-D Integration of Heterogeneous Technologies and Materials
5. D. S. Temple, E. P. Vick, D. M. Malta, M. R. Lueck, S. H. Goodwin, M. M. Fabean, C. S. Pace, M. S. Muzilla, C. M. Masterjohn, and M. R. Skokan, “High density vias-last 3D integration technology implemented in functional bulk CMOS mixed-signal processors for infrared focal plane arrays,” submitted for publication in IEEE Trans. Electron Devices.