Pad Surface Thermal Management during Copper Chemical Mechanical Planarization-Reference-Cited by-同舟云学术

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Pad Surface Thermal Management during Copper Chemical Mechanical Planarization

Published:2015 Issue:7 Volume:4 Page:P206-P212
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Wu C.,Sampurno Y.,Liao X.,Jiao Y.,Theng S.,Zhuang Y.,Borucki L.,Philipossian A.

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference35 articles.

1. Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process

2. Effect of Pad Surface Micro-Texture on Coefficient of Friction and Removal Rate during Copper CMP Process

3. Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model

4. Fan W. , Ph. D. Thesis, Massachusetts Institute of Technology, Cambridge, MA (2012).

5. Chemical mechanical planarization for microelectronics applications

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4. Effect of spray nozzle position on pad temperature distribution and wafer non-uniformity;Journal of Mechanical Science and Technology;2019-12

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