Author:
Lee Kihun,Lee Dasol,Jeong Seonho,Lee Donghwan,Jeong Haedo
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference15 articles.
1. D. Kwon, H. Kim and H. Jeong, Heat and its effects to chemical mechanical polishing, Journal of Materials Processing Technology, 178 (1-3) (2006) 82–87.
2. H. Kim, H. Kim, H. Jeong, E. Lee and Y. Shin, Friction and thermal phenomena in chemical mechanical polishing, Journal of Materials Processing Technology, 130 (2002) 334–338.
3. A. Sikder, I. Irfan, A. Kumar, A. Belyaev, S. Ostapenko, M. Calves, J. Harmon and J. Anthony, Evaluation of mechanical and tribological behavior, and surface characteristics of CMP pads, MRS Online Proceedings Library Archive, 671 (2001).
4. J. M. Steigerwald, S. P. Murarka and R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, USA (1997).
5. T. Matsunaga, M. Uneda, Y. Takahashi, K. Shibuya, Y. Nakamura, D. Ichikawa and K.-I. Ishikawa, Influence into platen and polishing pad surface temperature on removal rate in sapphire-chemical mechanical polishing, 2015 International Conference on Planarization/CMP Technology (ICPT), IEEE (2015) 1–4.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献