Investigation of thermal effects in copper chemical mechanical polishing
Author:
Funder
National Research Foundation of Korea
Publisher
Elsevier BV
Subject
General Engineering
Reference26 articles.
1. 450 mm silicon: an opportunity and wafer scaling;Watanabe;Interface-Electrochem Soc,2006
2. The way to zeros: the future of semiconductor device and chemical mechanical polishing technologies;Tsujimura;Jpn J Appl Phys,2016
3. Characterization and modeling of dynamic thermal behavior in CMP;White;J Electrochem Soc,2003
4. Effects of temperature on removal rate in Cu CMP;Park;J Kor Soc Manuf Process Eng,2018
5. Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process;Kim;Wear,2017
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