Abstract
Direct wafer bonding and thinning technologies are now extensively used in combination to produce SOI wafers. Emerging demands of new functionalities at the material or device level for 3D integration have allowed to increase the level of maturity of these technologies. This paper deals with the innovative 3D substrates and devices we have obtained in the frame of fruitful collaborations.
Publisher
The Electrochemical Society
Cited by
4 articles.
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