Author:
Gueguen Pierric,Ventosa Caroline,Cioccio Léa Di,Moriceau Hubert,Grossi François,Rivoire Maurice,Leduc Patrick,Clavelier Laurent
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. N. Sillon, A. Astier, H. Boutry, L. Di Cioccio, D. Henry, P. Leduc, Enabling technologies for 3D integration: from packaging miniaturization to advanced stacked ICs, in: Proceeding of IEDM 08, pp. 1–4.
2. L. Di Cioccio, P. Gueguen, F. Grossi, 3D Technologies at CEA-Leti Minatec, in: Proceedings of IMAPS 08.
3. P. Gueguen, L. Di Cioccio, M. Rivoire, et al., Copper direct bonding for 3D integration, in: Proceedings of the IEEE IITC Conference, 2008, p. 61.
4. P. Gueguen, L. Di Cioccio, J.Gonchond, 3D vertical interconnects by copper direct bonding, in: Proceeding of MRS, 2008.
5. Wafer bonding for silicon‐on‐insulator technologies
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