Author:
Dragoi Viorel,Lindner Paul
Reference8 articles.
1. Contact bonding, including direct bonding in a historical and recent context of materials science and technology, physics and chemistry. Historical review in a broader scope and comparative outlook;Haisma;Mat. Sci. Eng. R,2002
2. Field assisted glass-metal sealing;Wallis;J. Appl. Phys.,1969
3. EV Group products, .
4. SEMI—Semiconductor Equipment and Materials International, Global MEMS / NEMS Standards Committee, .
5. SEMI Ms5-1107: Test method for wafer bond strength measurements using micro-chevron test structures, .
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