Author:
Hong Joo-Pyo,Lee Ki Seok,Jung Midum,Song Kyeong-Seop
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference40 articles.
1. J. Wei, A new approach of creating Au-Sn solder bumps from electroplating, Cryst. Res. Technol., 41 (2) (2006) 150–153.
2. J. W. Yoon, H. S. Chun, J. M. Koo and S. B. Jung, Au-Sn flip-chip solder bump for microelectronic and optoelectronic applications, Microsyst. Technol., 13 (11/12) (2007) 1463–1469.
3. J. W. Yoon, B. I. Noh and S. B. Jung, Interfacial reaction between Au-Sn solder and Au/Ni-metallized Kovar, J. Mater. Sci.: Mater. Electron., 22 (2011) 84–90.
4. P. J. Wang, J. S. Kim and C. C. Lee, Fluxless bonding of large silicon chips to ceramic packages using electroplated eutectic Au/Sn/Au structures, J. Electron. Mat., 38 (10) (2009) 2106–2111.
5. T. A. Tollefsen, A. Larsson, O. M. Løvvik and K. Aasmundtveit, Au-Sn SLID bonding-properties and possibilities, Metall. Mat. Trans. B, 43B (2012) 397–405.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献