Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications-Reference-Cited by-同舟云学术

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Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

Published:2006-12-14 Issue:11-12 Volume:13 Page:1463-1469
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Yoon Jeong-Won,Chun Hyun-Suk,Koo Ja-Myeong,Jung Seung-Boo

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-006-0330-9.pdf

Reference8 articles.

1. Djurfors B, Ivey DG (2001) Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging. J Electron Mater 30:1249–1254

2. Djurfors B, Ivey DG (2002) Microstructural characterization of pulsed electrodeposited Au/Sn alloy thin films. Mater Sci Eng B 90:309–320

3. Doesburg J, Ivey DG (2000) Microstructure and preferred orientation of Au–Sn alloy plated deposits. Mater Sci Eng B 78:44–52

4. Elger G, Hutter M, Oppermann H, Aschenbrenner R, Reichl H, Jager E (2002) Development of an assembly process and reliability investigations for flip-chip LEDs using AuSn soldering. Microsyst Technol 7:239–243

5. Kim DW, Lee CC (2006) Fluxless flip-chip Sn-Au solder interconnect on thin Si wafers and Cu laminated polyimide films. Mater Sci Eng A 416:74–79

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