Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging-Reference-Cited by-同舟云学术

Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging

Published:2001-09 Issue:9 Volume:30 Page:1249-1254
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Djurfors B.,Ivey D. G.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0157-1.pdf

Reference9 articles.

1. W. Plumbridge, J. Mater. Sci. 31, 2501 (1996).

2. G. Matijasevic, Thin. Solid Films, 223, 276 (1993).

3. D.G. Ivey, Micron 29, 281 (1998).

4. A.J. Avila, Theory and Practice of Pulse Plating, ed. Puippe and Leaman, (Orlando, FL, Amer Electroplaters and Surface Finishers Soc., 1989), pp. 189–202.

5. J. Doesburg and D.G. Ivey, Plating and Surface Finishing 88, 78 (2001).

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