Chemical and Mechanical Aspects of a Co-Cu Planarization Scheme Based on an Alkaline Slurry Formulation
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference89 articles.
1. Direct Copper Electrochemical Deposition on Ru-Based Substrates for Advanced Interconnects Target 30 nm and ½ Pitch Lines: From Coupon to Full-Wafer Experiments
2. Synergetic effect of H2O2 and glycine on cobalt CMP in weakly alkaline slurry
3. The Effect of Glycine and Benzotriazole on Corrosion and Polishing Properties of Cobalt in Acid Slurry
4. BEOL Cu CMP Process Evaluation for Advanced Technology Nodes
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