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2. DPSSL and FL Pumps Based on 980nm-Telecom Pump Laser Technology: Changing the Industry;Lichtenstein,2004
3. Technology Trend and Challenges in High Power Semiconductor Laser Packaging;Liu,2009
4. Xingsheng Liu,Wei Zhao, Lingling Xiong and Hui Liu, “Packaging of high power semiconductor lasers,” Springer-Verlag New York Inc.(2014).
5. A study on the reliability of indium solder die bonding of high power semiconductor lasers