The Influence of Welding Interfacial Voids on the Thermal Conductivity of Space-borne High-power Electronics-Reference-Cited by-同舟云学术

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The Influence of Welding Interfacial Voids on the Thermal Conductivity of Space-borne High-power Electronics

Published:2023-08-08 Issue: Volume:45 Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhang Le¹,Zhong Guisheng²,Diwu Dongchao³,Wang Rui¹,Chen Zhengping³,Jin Zhansi³

Affiliation:

1. China Academy of Space Technology (Xi’an),National Key Laboratory of Science and Technology on Space Microwave,Xi’an,China

2. Shantou University,Engineering(College of Engineering),Department of Mechanical,Shantou,China

3. China Aerospace Science and Technology Corporation,China Academy of Space Technology (Xi’an),Xi’an,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10491912.pdf?arnumber=10491912

Reference20 articles.

1. 80W GaN SSPAs for spaceflight application

2. New Progress in GaN Microelectronics[J];Zhengping;Semiconductor Technology,36

3. Millimeter-Wave GaN MMIC Power Amplifier[D];Li;Cheng du, University of Electronic Science and Technology of China,2019

4. Research on GaN HEMTs and MMIC Power Amplifiers for Millimeter Wave[D];Yang;Xi’an, Xidian University,2018

5. Flexible S-band SSPA for Space Application

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