The two-phase flow simulation and experimental research on the formation of solder voids in power module

Author:

Wang Zheng-Duo,Luan Xing-He,Zhou Zheng,Wu Feng-Shun,Zhou Long-Zao,Liu Hui

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference43 articles.

1. FE analysis the effect of bonding wire and solder failure on the resistance and temperature of IGBT;Jingyi,2018

2. Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling;Benabou;Microelectron. Reliab.,2016

3. Solder void modeling and its influence on thermal characteristics of MOSFETs in automotive electronics module;Sridharan;SAE International Journal of Passenger Cars-Electronic and Electrical Systems,2017

4. How to control voiding in reflow soldering;Lee;Chip Scale Review,2005

5. Thermal and Thermo-Mechanical Performance of Voided Lead-Free Solder Thermal Interface Materials for Chip-Scale Packaged Power Device;Otiaba,2013

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