A study on the reliability of indium solder die bonding of high power semiconductor lasers
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2209194
Reference26 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
3. Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints
4. Current-crowding-induced electromigration failure in flip chip solder joints
5. Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads
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