Reducing EUV mask 3D effects by alternative metal absorbers-Reference-Cited by-同舟云学术

Reducing EUV mask 3D effects by alternative metal absorbers

Published:2017-03-24 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Philipsen Vicky¹,Luong Kim Vu¹,Souriau Laurent¹,Hendrickx Eric¹,Erdmann Andreas²,Xu Dongbo²,Evanschitzky Peter²,van de Kruijs Robbert W. E.³,Edrisi Arash³,Scholze Frank⁴,Laubis Christian⁴,Irmscher Mathias⁵,Naasz Sandra⁵,Reuter Christian⁵

Affiliation:

1. IMEC (Belgium)

2. Fraunhofer IISB (Germany)

3. Univ. Twente (Netherlands)

4. PTB (Germany)

5. IMS CHIPS (Germany)

Publisher

SPIE

Reference27 articles.

1. Single exposure EUV patterning of BEOL metal layers on the imec iN7 platform;Blanco Carballo,2017

2. SAQP & EUV block patterning of BEOL metal layers on imec’s iN7 platform;Bekaert,2017

3. Imaging impact of multilayer tuning in EUV masks, experimental validation;Philipsen,2014

4. Alternative EUV mask technology to compensate for mask 3D effects;Van Look,2015

5. Mask 3D effect mitigation by source optimization and assist feature placement;Van Look,2016

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