Advanced mask process modeling for 45-nm and 32-nm nodes-Reference-Cited by-同舟云学术

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Advanced mask process modeling for 45-nm and 32-nm nodes

Published:2008-03-14 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Optical Microlithography XXI
language:
Short-container-title:

Author:

Tejnil Edita,Hu Yuanfang,Sahouria Emile,Schulze Steffen,Tian Ming Jing,Guo Eric

Publisher

SPIE

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mask modeling using a deep learning approach;Photomask Technology 2019;2019-09-26

2. Aerial image metrology for OPC modeling and mask qualification;33rd European Mask and Lithography Conference;2017-09-28

3. Effective use of aerial image metrology for calibration of OPC models;SPIE Proceedings;2017-03-17

4. Incorporating photomask shape uncertainty in computational lithography;SPIE Proceedings;2016-03-15

5. Accurate mask model for advanced nodes;SPIE Proceedings;2014-07-28

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