Robust 2D patterns process variability assessment using CD-SEM contour extraction offline metrology-Reference-Cited by-同舟云学术

Robust 2D patterns process variability assessment using CD-SEM contour extraction offline metrology

Published:2017-03-28 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Lakcher Amine¹,Le-Gratiet Bertrand¹,Ducoté Julien¹,Fanton Pierre¹,Kiers Ton²,Gemmink Jan-Willem²,Hunsche Stefan³,Prentice Christopher⁴,Besacier Maxime⁵

Affiliation:

1. STMicroelectronics (France)

2. ASML Netherlands B.V. (Netherlands)

3. ASML US, Inc. (United States)

4. ASML SARL (France)

5. Univ. Grenoble Alpes, LTM-CNRS (France)

Publisher

SPIE

Reference11 articles.

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3. Challenge to New Metrology World by CD-SEM and Design;Koshihara,2008

4. Assessing SEM contour based OPC models quality using rigorous simulation;Weisbuch,2014

5. Bringing SEM-contour based OPC to production

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