Process highlights to enhance directed self-assembly contact patterning performances
Author:
Affiliation:
1. CEA-LETI, MINATEC, 17 Rue des Martyrs, 38054 Grenoble, Cedex 9, France
2. STMicroelectronics, 850 Rue Jean Monnet, 38920 Crolles, France
3. ARKEMA FRANCE, Route Nationale 117, BP34-64170 Lacq, France
Publisher
SPIE-Intl Soc Optical Eng
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Block Copolymer Based Nanostructures: Materials, Processes, and Applications to Electronics
2. Simple and Versatile Methods To Integrate Directed Self-Assembly with Optical Lithography Using a Polarity-Switched Photoresist
3. The potential of block copolymer’s directed self-assembly for contact hole shrink and contact multiplication
4. SRAM, NAND, DRAM contact hole patterning using block copolymer directed self-assembly guided by small topographical templates
5. Self-assembly patterning for sub-15nm half-pitch: a transition from lab to fab
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1. Directed Self-Assembly of Block Copolymers for the Fabrication of Functional Devices;Polymers;2020-10-21
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3. X-ray characterization of contact holes for block copolymer lithography;Journal of Applied Crystallography;2019-02-01
4. Pillars fabrication by DSA lithography: material and process options;Advances in Patterning Materials and Processes XXXV;2018-03-19
5. An embedded neutral layer for advanced surface affinity control in grapho-epitaxy directed self-assembly;Nanoscale;2018
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