EUV lithography at chipmakers has started: performance validation of ASML's NXE:3100-Reference-Cited by-同舟云学术

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EUV lithography at chipmakers has started: performance validation of ASML's NXE:3100

Published:2011-03-17 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Wagner Christian,Bacelar Jose,Harned Noreen,Loopstra Erik,Hendriks Stef,de Jong Ivo,Kuerz Peter,Levasier Leon,van de Kerkhof Mark,Lowisch Martin,Meiling Hans,Ockwell David,Peeters Rudy,van Setten Eelco,Stoeldraijer Judon,Young Stuart,Zimmerman John,Kool Ron

Publisher

SPIE

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chemical and structural characterization of EUV photoresists as a function of depth by standing-wave x-ray photoelectron spectroscopy;Journal of Micro/Nanopatterning, Materials, and Metrology;2021-07-21

2. Additive Lithography–Organic Monolayer Patterning Coupled with an Area-Selective Deposition;ACS Applied Materials & Interfaces;2021-01-20

3. EUV Lithography Technology for High-volume Production of Semiconductor Devices;Journal of Photopolymer Science and Technology;2019-06-24

4. High Power LPP-EUV Source with Long Collector Mirror Lifetime for Semiconductor High Volume Manufacturing;Journal of Photopolymer Science and Technology;2019-06-24

5. Scatterometry for advanced process control in semiconductor device manufacturing;Fifth International Conference on Optical and Photonics Engineering;2017-06-13

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