Polishing performances of different optics with different size powder and different pH value slurries during CMP polishing-Reference-Cited by-同舟云学术

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Polishing performances of different optics with different size powder and different pH value slurries during CMP polishing

Published:2015-10-12 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Cao Jun,Wei Chaoyang,Liu Shijie,Dun Aihuan,Yang Minghong,Xu Xueke,Shao Jianda

Publisher

SPIE

Reference13 articles.

1. NIF optical materials and fabrication technologies: An overview;Campbell,2004

2. Adsorption behavior of anionic polyelectrolyte for chemical mechanical polishing (CMP)

3. Stabilization of Alumina Polishing Slurries Using Phosphonate Dispersants

4. Microscopic Removal Function and the Relationship Between Slurry Particle Size Distribution and Workpiece Roughness During Pad Polishing

5. CMP challenges below a quarter micron,;Dejule’,1997

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel procedure for the identification of a starting point for the CMP;Advanced Optical Technologies;2022-10-21

2. The properties of zirconia during the fused silica polishing process;Second Symposium on Novel Technology of X-Ray Imaging;2019-05-10

3. Impact of slurry pH on material removal rate and surface quality of polished fused silica;Optifab 2017;2017-10-16

4. Experimental power spectral density analysis for mid- to high-spatial frequency surface error control;Applied Optics;2017-06-19

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