Microscopic Removal Function and the Relationship Between Slurry Particle Size Distribution and Workpiece Roughness During Pad Polishing-Reference-Cited by-同舟云学术

Microscopic Removal Function and the Relationship Between Slurry Particle Size Distribution and Workpiece Roughness During Pad Polishing

Published:2013-11-29 Issue:1 Volume:97 Page:81-91
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J. Am. Ceram. Soc.

Author:

Suratwala Tayyab¹,Feit Michael¹,Steele William¹,Wong Lana¹,Shen Nan¹,Dylla-Spears Rebecca¹,Desjardin Richard¹,Mason Daniel¹,Geraghty Paul¹,Miller Philip¹,Baxamusa Salmaan¹

Affiliation:

1. Lawrence Livermore National Laboratory; P.O. Box 808 Livermore California 94551

Funder

Lawrence Livermore National Laboratory

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/jace.12631/fullpdf

Reference27 articles.

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3. Hydrodynamics of Slurry Flow in Chemical Mechanical Polishing;Terrell;J. Electrochem. Soc.,2006

4. Tribology Analysis of Chemical Mechanical Polishing;Runnels;J. Electrochem. Soc.,1994

5. Hydrodynamic Analysis of Chemical Mechanical Polishing Process;Park;J. Tribology Int.,2000

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