Model-free measurement of lateral recess in gate-all-around transistors with micro hard-X-ray fluorescence
Author:
Affiliation:
1. Imec, Leuven, Belgium
2. Bruker Technologies Ltd., Migdal Ha’Emek, Israel
Publisher
SPIE-Intl Soc Optical Eng
Subject
General Arts and Humanities
Reference23 articles.
1. A view on the logic technology roadmap;Horiguchi,2021
2. A novel dry selective etch of SiGe for the enablement of high performance logic stacked gate-all-around nanosheet devices;Loubet,2019
3. (Invited) Selective Etches for Gate-All-Around (GAA) Device Integration: Opportunities and Challenges
4. (Keynote) Gate-All-Around Nanowire & Nanosheet FETs for Advanced, Ultra-Scaled Technologies
5. Spectroscopy: a new route towards critical-dimension metrology of the cavity etch of nanosheet transistors
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1. Reference-free x-ray fluorescence analysis with a micrometer-sized incident beam;Nanotechnology;2024-04-24
2. Superlattice effects and limitations of non-destructive measurement of advanced Si/Si(1-x)Ge(x) superlattice structures using Mueller matrix scatterometry (MMSE) and high-resolution x-ray diffraction (XRD);Metrology, Inspection, and Process Control XXXVIII;2024-04-10
3. Detection of structural asymmetries in Forksheet FET arrays using Mueller matrix ellipsometry: a theoretical study;Journal of Micro/Nanopatterning, Materials, and Metrology;2024-02-09
4. Taming the Distribution of Light in Gate-All-Around Semiconductor Devices;Nano Letters;2024-01-17
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