Development of spin-on metal hardmask (SOMHM) for advanced node-Reference-Cited by-同舟云学术

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Development of spin-on metal hardmask (SOMHM) for advanced node

Published:2015-03-20 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Advances in Patterning Materials and Processes XXXII
language:
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Author:

Yamada Shintaro,Wang Deyan,Chuang Vivian,Liu Cong,Wong Sabrina,Clark Michael B.,Cutler Charlotte,Williams William,Baranowski Paul,Li Mingqi,Mattia Joe,Leonard JoAnne,Trefonas Peter,O’Connell Kathleen,Xu Cheng bai

Publisher

SPIE

Reference7 articles.

1. Immersion resist process for 32-nm node logic devices

2. Silicon containing polymer in applications for 193 nm high NA lithography processes

3. Spin-on hard mask with dual-BARC property for 50-nm devices

4. Functional Properties of Novel Metallic Hard Masks

5. Performance of tri-layer process required for 22 nm and beyond;Wei,2011

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The development of an SC1 removable si-anti-reflective-coating;Advances in Patterning Materials and Processes XXXV;2018-03-13

2. Development of TiO2 containing hardmasks through plasma-enhanced atomic layer deposition;Journal of Micro/Nanolithography, MEMS, and MOEMS;2017-05-23

3. Development of TiO2 containing hardmasks through PEALD deposition;SPIE Proceedings;2017-03-27

4. Overview of materials and processes for lithography;Materials and Processes for Next Generation Lithography;2016

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