New wave front phase sensor used for 3D shape measurements of patterned silicon wafers

Author:

Trujillo-Sevilla Juan M.,Gómez-Cárdenes Óscar,Roqué-Velasco Alex,Sicilia Miguel A.,González Pardo Javier,Ramos-Rodríguez José Manuel,Gaudestad Jan O.

Publisher

SPIE

Reference27 articles.

1. Excursion detection and rootcause analysis using virtual overlay metrology;van Dijk,2021

2. Wafer-shape based in-plane distortion predictions using superfast 4G metrology;van Dijk,2017

3. Intra-field stress impact on global wafer deformation;van Haren,2019

4. Characterization and mitigation of overlay error on silicon wafers with nonuniform stress;Brunner,2014

5. US6847458B2 patent “Method and apparatus for measuring the shape and thickness variation of polished opaque plates” 2003

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. 3D Shape Measurements of Patterned Silicon Wafers;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

2. Repeatability study of silicon wafer shape measurements;Photonic Instrumentation Engineering XI;2024-03-11

3. New wave front phase sensor used for 3D shape measurements of patterned silicon wafers;38th European Mask and Lithography Conference (EMLC 2023);2023-10-05

4. New patterned silicon wafer shape metrology system;Novel Optical Systems, Methods, and Applications XXVI;2023-09-28

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