New metrology technique for measuring wafer geometry on a full 300mm silicon wafer-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

New metrology technique for measuring wafer geometry on a full 300mm silicon wafer

Published:2021-10-12 Issue: Volume: Page:
ISSN:
Container-title:International Conference on Extreme Ultraviolet Lithography 2021
language:
Short-container-title:

Author:

Trujillo-Sevilla Juan M.,Casanova-González Oscar,Velasco-Ocaña Miriam,Ceruso Sabato,Oliva-García Ricardo,Gómez-Cárdenes Óscar,Martín-Hernández Javier,Roqué-Velasco Alex,Pérez-García Álvaro,Ramos José Manuel,Gaudestad Jan O.

Publisher

SPIE

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Dynamic ultra-thin film thickness line-profile extraction from a warped Si substrate;Metrology, Inspection, and Process Control XXXVIII;2024-04-10

2. New technique for measuring free-form wafer shape for feed-forward overlay corrections;International Conference on Extreme Ultraviolet Lithography 2023;2023-11-21

3. New wafer shape measurement technique for 300mm blank vertically held silicon wafers;Optical Measurement Systems for Industrial Inspection XIII;2023-08-15

4. New metrology technique for measuring the free shape of a patterned 300mm wafer held vertically;Metrology, Inspection, and Process Control XXXVII;2023-04-27

5. New wave front phase sensor used for 3D shape measurements of patterned silicon wafers;International Conference on Extreme Ultraviolet Lithography 2022;2022-12-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP