New wafer shape measurement technique for 300mm blank vertically held silicon wafers

Author:

Trujillo-Sevilla Juan M.,Abrante Rubén,Jiménez Miguel,Ivanov Kurtev Kiril,Castro Luis Guillermo,Gaudestad Jan O.

Publisher

SPIE

Reference15 articles.

1. Bare wafer metrology challenges in microlithography at 45 nm node and beyond

2. Role Of Process-induced Wafer Geometry Changes In Advanced Semiconductor Manufacturing;Kevin,2014

3. SPIE Advanced Lithography Conference 2017, “Wafer-shape based in-plane distortion predictions using superfast 4G metrology”, February 2017, San Jose, CA, USA, Leon van Dijk, Jeffrey Mileham, Ilja Malakhovsky, David Laidler, Harold Dekkers,

4. Determining local residual stresses from high resolution wafer geometry measurements;Gong,2013

5. US6847458B2 patent “Method and apparatus for measuring the shape and thickness variation of polished opaque plates” 2003

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