Three-dimensional physical photoresist model calibration and profile-based pattern verification-Reference-Cited by-同舟云学术

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Three-dimensional physical photoresist model calibration and profile-based pattern verification

Published:2010-03-11 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Talbi Mohamed,Abdo Amr Y.,Bailey Todd C.,Conley Will,Dunn Derren N.,Fujimoto Masashi,Nickel John,Chung No Young,Marokkey Sajan,Lee Si Hyeung,Sarma Chandrasekhar,Shao Dongbing,Viswanathan Ramya

Publisher

SPIE

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Full-chip model-based OPC verification by using rigorous resist 3D model;SPIE Proceedings;2014-03-31

2. Source and mask optimization to mitigate hotspots in etch process;SPIE Proceedings;2013-04-12

3. (Invited) Advanced Modeling for Full-Chip Low-k1 Lithography Simulations;ECS Transactions;2013-03-08

4. A full-chip 3D computational lithography framework;SPIE Proceedings;2012-02-21

5. 3D lithography modeling for ground rule development;SPIE Proceedings;2011-03-17

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