Cl2reactive ion etching mechanisms studied byinsitudetermination of ion energy and ion flux
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.347495
Reference41 articles.
1. Ion‐surface interactions in plasma etching
2. Surface modification in plasma-assisted etching of silicon
3. Surface modification in plasma-assisted etching of silicon
4. Argon‐ion assisted etching of silicon by molecular chlorine
5. Argon‐ion assisted etching of silicon by molecular chlorine
Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Study on feature profile evolution for chlorine etching of silicon in an RF biased sheath;Vacuum;2013-03
2. Molecular dynamics simulations of Cl+ etching on a Si(100) surface;Journal of Applied Physics;2010-06
3. Sn debris cleaning by plasma in DPP EUV source systems for HVM;SPIE Proceedings;2010-03-11
4. Black silicon method: X. A review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment;Journal of Micromechanics and Microengineering;2009-02-02
5. Ions in holes: An experimental study of ion distributions inside surface features on radio-frequency-biased wafers in plasma etching discharges;Journal of Applied Physics;2002-07-15
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3