Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2425040
Reference10 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
3. Electrochromic semiconductor nanocrystal films
4. Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints
5. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
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1. The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration;Materials Today Communications;2023-08
2. An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection;Sensors;2018-06-21
3. Intelligent diagnosis of flip chip solder bumps using high-frequency ultrasound and a naive Bayes classifier;Insight - Non-Destructive Testing and Condition Monitoring;2018-05-01
4. Using GA-SVM for defect inspection of flip chips based on vibration signals;Microelectronics Reliability;2018-02
5. Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF;Mechanical Systems and Signal Processing;2017-02
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