Low temperature fabrication and characterization of nickel germanide Schottky source/drain contacts for implant-less germanium p-channel metal-oxide-semiconductor field-effect transistors
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4712564
Reference15 articles.
1. Strained Ge channel p-type metal–oxide–semiconductor field-effect transistors grown on Si1−xGex/Si virtual substrates
2. Oxidation of Ge(100) and Ge(111) surfaces: an UPS and XPS study
3. Alternative surface passivation on germanium for metal-oxide-semiconductor applications with high-k gate dielectric
4. Effect of surface NH3 anneal on the physical and electrical properties of HfO2 films on Ge substrate
5. Characterization of the “clean-up” of the oxidized Ge(100) surface by atomic layer deposition
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1. Collective spin behavior of NiGe thin films on MgO substrate;Journal of Magnetism and Magnetic Materials;2021-06
2. Electrical characterisation of PVD germanium resistors with rapid melt growth (RMG) process;AIP Conference Proceedings;2018
3. Experimental Realization of Thermal Stability Enhancement of Nickel Germanide Alloy by Using TiN Metal Capping;IEEE Transactions on Electron Devices;2017-05
4. Experimental Realization of a Ternary-Phase Alloy Through Microwave-Activated Annealing for Ge Schottky pMOSFETs;IEEE Transactions on Electron Devices;2016-07
5. New concept of planar germanium MOSFET with stacked germanide layers at source/drain;Japanese Journal of Applied Physics;2015-03-19
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