The effect of FeGa (0/–) level presence on material properties in dilute AlxGa1−xN layers

Abstract

AlxGa1−xN epilayers are used as the basis of ultraviolet LEDs and detectors. The trap states produced by defects and impurities can play a key role in the device performance. In this work, conventional deep-level transient spectroscopy, photoluminescence (PL), and secondary ion mass spectrometry have been used to characterize a deep-level trap termed as E3 in dilute AlxGa1−xN (x < 0.063) epilayers grown by metal-organic vapor phase epitaxy (MOVPE) on highly conductive ammono-GaN substrates. The AlxGa1−xN epilayers were doped with silicon to about 3 × 1016 cm−3. The electrical and the optical measurements were conducted on Ni/Au Schottky barrier diodes and virgin samples, respectively. First, we observed a general trend that the E3 (FeGa) electron trap concentration significantly changes along the wafers in AlxGa1−xN layers that is fully consistent with previously reported results for GaN materials grown by the MOVPE technique. Second, we report that the activation energies for electron emission for the E1 and E3 traps in dilute AlxGa1−xN exhibit linear variations with Al content. Moreover, low-temperature PL results show a proportional relation between the intensity of the line with its maximum at 1.299 eV and concentration of residual Fe impurity. Finally, we discuss how the presence of defects resulting from Fe contamination may result in degradation of AlxGa1−xN-based devices.