Thermodynamics and kinetics of room-temperature microstructural evolution in copper films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1596366
Reference35 articles.
1. Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
2. Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature
3. X-ray diffraction pole figure evidence for (111) sidewall texture of electroplated Cu in submicron damascene trenches
4. Two-step room temperature grain growth in electroplated copper
5. Self-annealing characterization of electroplated copper films
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